ShanghaiApril 26, 2026 /PRNewswire/ — On April 25, at the 2026 Beijing International Automotive Exhibition, Quectel Wireless Solutions launched three 5G+AI cockpit-integrated intelligent cockpit solutions. Based on multiple Qualcomm platforms, this series of solutions covers multi-gradient AI computing power and multimedia capabilities, while integrating cutting-edge communication technologies such as 5G, Wi-Fi 6E/7, and Bluetooth 5.4. With a highly integrated design, it bridges the boundaries between the cockpit domain and the connectivity domain, transforming the vehicle infotainment system from simple screen splicing into a “smart whole” that can perceive, think, and collaborate.
In the past, competition in intelligent cockpits often focused on the number and size of screens. However, with the accelerated arrival of the software-defined vehicle era, “cockpit-connectivity integration” is becoming a core path for automakers to achieve product premiumization and intelligence. Quectel’s newly launched full-series cockpit-connectivity integrated solutions directly address pain points such as fragmented multi-system architectures and sluggish interactive experiences in traditional vehicle infotainment systems, driving the cockpit’s leap from “multi-screen stacking” to “intelligent collaboration.”
Wang Min, General Manager of Quectel’s Automotive Front-Loading Division and President of Ruiyuan Zhixing, stated: “Cockpit-connectivity integration is gradually becoming a key exploration direction for next-generation intelligent cockpit development. The 5G+AI cockpit-integrated intelligent cockpit solutions we are launching this time, with their high integration, ease of development, and rapid mass production advantages, help automakers efficiently deliver premium intelligent experiences while controlling costs, providing users with a smart and reassuring driving and riding experience.”
Three “Smart Brains,” Precisely Adapted to Different Vehicle Models
To meet the intelligent upgrade needs of vehicles at different levels and with different positioning, Quectel has introduced three tiered cockpit solutions this time. Whether it’s a flagship luxury model pursuing ultimate performance, a high-end mainstream model focusing on experience, or a budget-friendly family economy model, there is a precisely matched option. The three SiP products are fully Pin2Pin compatible, and leveraging a highly reusable software platform, they can help partners efficiently and with high quality complete project implementation.
AS900P Flagship Choice (Based on Qualcomm QCM8838)
Adopts an advanced 3nm process chip, with CPU computing power up to 300K DMIPS and NPU AI computing power reaching 64 TOPS. It possesses strong capabilities for deploying on-vehicle large models on the device side, specifically designed as the “smart brain” for flagship luxury models.
AS830M High-End Configuration (Based on Qualcomm QCM8538)
Built with a 4nm process chip, CPU computing power of 200K DMIPS, and NPU computing power of 48 TOPS. It can smoothly run mainstream large models on the device side and excels in multimedia processing and multi-screen interaction capabilities, making it the preferred choice for high-end models seeking cutting-edge intelligent experiences.
AS700E Economy Configuration (Based on Qualcomm QCM6650)
Also equipped with a 4nm process chip, CPU computing power of 140K DMIPS, and NPU computing power of 6 TOPS. With its high integration and cost-effectiveness advantages, it becomes the main solution for popularizing cockpit-integrated experiences.
Multi-Screen Ultra-Sensory Vision, Millisecond Boundless Connectivity
In terms of visual presentation capabilities, the three platforms also demonstrate impressive strength:
- AS900P supports up to 8 screens in sync, 8K@60fps ultra-high-definition display output, and connection of 16 or more cameras;
- AS830M supports 6 screens in sync, 8K@30 display output, and connection of 17 cameras;
- AS700E can achieve 3 screens in sync, 4K@60fps display output, and connection of 9 cameras.
The above solutions comprehensively cover full-scenario perception needs such as Driver Monitoring System (DMS), Around View Monitor (AVM), and Rear View Camera (RVC).
On the communication front, the solutions fully support the 3GPP 5G R16 standard. With millisecond-level latency and highly reliable cellular connectivity, they ensure smooth ultra-high-definition video, real-time traffic conditions, and large model interactions. Additionally, they integrate Wi-Fi 6/6E and Bluetooth 5.4, fully compatible with LE Audio. Whether it’s in-car wireless screen projection, keyless unlocking via digital keys, or multi-device audio sharing, they provide a stable and seamless boundless connection experience.
Lightweight Container Security Isolation, Proactive AI Intelligent Interaction
Addressing user concerns about whether “more features mean higher risk of crashes,” the three cockpit-integrated solutions all adopt an LXC lightweight container architecture, isolating the instrument cluster, T-BOX, and IVI infotainment system into separate domains. This means that even if rear-seat passengers are playing a 4K high-definition video, causing the infotainment system load to max out, the driver’s instrument cluster display and key vehicle communication functions can still run smoothly in an independent environment, eliminating the risk of black screens and lag through a clearly divided architecture.
At the same time, leveraging the platform’s powerful AI capabilities, the cockpit can achieve multi-modal collaborative interaction of voice, vision, and scenarios. It is no longer a cold machine but an intelligent partner that can perceive user habits, understand voice commands, and anticipate potential needs—from personalized adaptation upon entry, to proactive reminders about road conditions during the journey, to thoughtful service pushes before arrival, making every trip more attuned to user needs.
Automotive-Grade System Assurance, Large-Scale Mass Production Implementation
Relying on mainstream automotive-grade standards and authoritative certification systems such as IATF 16949, AEC-Q104, ISO 26262, ASPICE, and ISO/SAE 21434, combined with mature BGA SiP/Underfill system-level packaging and fully automated production systems, Quectel has completed large-scale automotive-grade verification of the solutions and possesses stable delivery capabilities. Currently, this series of solutions has been mass-produced and implemented in multiple mainstream automakers, quickly adapting to the intelligent needs of all vehicle categories from entry-level family cars to flagship luxury models.
Quectel always focuses on user experience, continuously deepening innovation in intelligent cockpit software and integrated architectures. In the future, Quectel will further accelerate the popularization and application of cockpit-connectivity integration technology, collaborating with ecosystem partners like Qualcomm to help global automakers create smarter and more human-centric next-generation mobility spaces.