XiamenMay 11, 2026 /PRNewswire/ — As a key player with a full industry chain layout in the global compound semiconductor sector, Sanan Optoelectronics is leveraging its vertical integration advantages—spanning materials, epitaxy, chip design, wafer fabrication, and packaging and testing—to establish a systematic presence in the optical communication and optical interconnect fields. Through gradient product iteration, high-end technological breakthroughs, and diversified scenario expansion, the company is steadily transitioning from a traditional optoelectronic device supplier to a core global optical chip manufacturer in the AI computing era.
Product Iteration: Gradient Layout of High-Speed Optical Chips, Stable Delivery of Mainstream Rates
Currently, the global data center market is at a critical juncture, with 400G achieving large-scale commercial use, 800G rapidly penetrating, and 1.6T accelerating in iteration. The delivery capability and iteration pace of high-speed optical chips directly determine a company’s position in the global computing power supply chain. Sanan Optoelectronics has achieved mass shipments of commercial optical chips for 400G/800G optical modules, with supporting high-speed PD photodetectors also entering volume supply. The product performance, stability, and delivery capabilities have been recognized by leading global customers, solidifying the foundation for business growth. Targeting the next-generation ultra-high-speed transmission market, the high-speed optical chips developed by Sanan for 1.6T optical modules have entered the customer sampling and joint verification phase, with technical specifications aligning with mainstream industry solutions. Even more advanced 3.2T optical chips have initiated R&D efforts. From mass production and customer validation to cutting-edge pre-research, the company has established a clear and sustainable technology iteration rhythm, precisely matching the rate upgrade cycles of global data centers.
Technological Breakthrough: 100G EML Chip Launched, High-End Device Capabilities Upgraded
In April 2026, Sanan Optoelectronics officially launched its self-developed 100G EML (Electro-Absorption Modulated Laser) chip, further enhancing its high-end technological competitiveness. This chip is specifically designed for mainstream 400G/800G long-reach optical module solutions, achieving industry-leading levels in transmission rate, temperature adaptability, and long-term reliability. It also realizes full-process engineering implementation from epitaxial growth and chip design to process packaging, with mass production capabilities. This effectively fills the high-end optical device product matrix and strengthens global competitiveness in medium-to-long-reach high-speed transmission scenarios.
Scenario Expansion: Multi-Point Breakthroughs in Frontier Technologies, Opening New Growth Tracks
Beyond the core data center track, Sanan Optoelectronics is continuously expanding into incremental scenarios such as novel optical interconnects and automotive optoelectronics, broadening its growth boundaries. In the field of short-reach high-speed interconnects, the company, in collaboration with universities and communication enterprises, has developed high-speed Micro LED light source devices that offer a new solution for high-density transmission between AI chips. These devices have been sent to international customers for sampling and testing, demonstrating clear industrialization potential.
In the smart vehicle sector, the company’s wide-temperature-range VCSEL chip has passed automotive-grade certification from leading new energy vehicle manufacturers, enabling stable operation under extreme conditions. It is expected to achieve large-scale deployment in vehicles by 2026, opening up a new market for in-vehicle optical communication.
Global Layout: Overseas Certification Achieved, Joining the First Tier of the Global Supply Chain
In terms of global expansion, Sanan Optoelectronics’ CW (Continuous Wave) light source products have passed certification from leading overseas tech companies, covering two mainstream power specifications: 70mW and 100mW. These products are compatible with full-series optical module solutions from 400G to 1.6T. This certification marks that the company’s manufacturing processes, quality control systems, and mass production capabilities have entered the global first tier, integrating into the high-end computing power supply chain worldwide.
Strategic Upgrade: Optical Chips as Core Engine, Positioning for a New Global Industry Cycle
From an industry development perspective, Sanan Optoelectronics has built a full-chain technology and production capacity system in optical communication, optical interconnects, and automotive optoelectronics. Amid the ongoing upgrade of AI computing power and the widespread adoption of optical interconnects, optical chips have become the company’s core strategic growth engine, evolving from a supplementary business option to a long-term development imperative.
Leveraging its full-industry-chain IDM (Integrated Device Manufacturer) expertise, steady product iteration pace, and global market layout, Sanan Optoelectronics has completed its strategic positioning in the global optical interconnect wave. With the continued rollout of high-end products, stable release of production capacity, and accelerated deployment of emerging application scenarios, the company is poised to deeply benefit from the AI computing power upgrade dividend, firmly establishing itself as a core player in the next-generation global computing infrastructure.