XiamenMay 14, 2026 /PRNewswire/ — As AI chip power consumption continues to rise, the silicon interposers used in mainstream packaging solutions like CoWoS have reached their thermal dissipation limits, making material innovation the core breakthrough for advanced packaging bottlenecks. According to data from Fortune Business Insights, the global advanced packaging market is valued at $42.3 billion in 2025 and is projected to grow to $70.4 billion by 2034. In the era of high computing power, the advanced packaging industry is poised for vast development opportunities.
As a key player in China’s compound semiconductor industry with a full-chain layout, Sanan Optoelectronics has strategically entered the wide-bandgap material sectors such as silicon carbide and diamond. Focusing on three core directions—AR optics, interposers, and heat sinks—the company has built a unique competitive edge in advanced packaging. Multiple technological achievements have entered the sampling or mass delivery stage, providing an important benchmark for enhancing the performance of global AI chips.
AR Optical Substrates: Empowering Optical Packaging with Wide-Bandgap Materials
In the field of AR optical substrates, silicon carbide boasts a refractive index of 2.7 (compared to approximately 2.0 for traditional glass) and a thermal conductivity over 100 times that of glass, offering excellent optical and thermal properties. Sanan Optoelectronics provides comprehensive services for Micro LED and silicon carbide optical materials. Currently, its 8-inch optical silicon carbide substrates have passed customer validation, and 12-inch products have achieved small-batch delivery, providing core material support for upgrading AR device performance.
Silicon Carbide Interposers: Precisely Addressing Thermal Challenges for High-End AI Packaging
Silicon carbide interposers precisely address thermal dissipation challenges, with a thermal conductivity approximately three times that of silicon. This can reduce GPU junction temperatures by 20–30°C and lower cooling costs by about 30%. Currently, Sanan Optoelectronics’ 12-inch silicon carbide substrates are undergoing validation with leading customers for next-generation AI chip packaging, positioning them as a potential mainstream choice for advanced packaging solutions.
Heat Sinks: Dual-Material Strategy for Diverse Thermal Needs
In the heat sink sector, Sanan Optoelectronics adopts a dual-track approach with diamond and silicon carbide to meet diverse thermal dissipation requirements. Diamond heat sink substrates, with a thermal conductivity of 2300 W/(m·K), significantly reduce thermal resistance compared to ceramic substrates in high-power laser applications, having passed 1,000-hour aging tests and achieved mass delivery. Silicon carbide heat sink products have completed sampling and testing, gradually advancing toward commercial deployment.
Full-Chain Production Capacity: Ensuring Supply and Supporting Large-Scale Technology Implementation
Production capacity is a critical foundation for technology deployment. Sanan Optoelectronics has established two core manufacturing bases in Hunan and Chongqing, forming a full-chain autonomous manufacturing capability from substrates to modules. The Hunan base has a monthly production capacity of 16,000 6-inch silicon carbide chips, 1,000 8-inch substrates, and 2,000 8-inch epitaxial wafers, with its 8-inch chip production line now operational and in mass production. The Chongqing base has a monthly capacity of 3,000 8-inch substrates, with output gradually ramping up to strengthen the supply of large-size silicon carbide materials. Sanan Optoelectronics’ silicon carbide diodes from Hunan cover a full voltage range from 650V to 2000V, with cumulative shipments reaching 400 million units and cumulative sales revenue of nearly 2 billion yuan within three years of production. The company holds a leading position in China’s silicon carbide power device market, providing a solid market foundation for the industrialization of advanced packaging materials.
With wide-bandgap technology at its core, Sanan Optoelectronics is strengthening the foundation of advanced packaging materials. By proactively investing in cutting-edge new processes, the company will continue to lead breakthroughs in core materials, supporting the performance upgrade of global AI chips with Chinese solutions and driving the advanced packaging industry toward higher-end development.