Shenzhen and TianjinMay 19, 2026 /PRNewswire/ — On May 19, 2026, Xingyuan JingSuan Technology (Shenzhen) Co., Ltd. and the Tianjin Research Institute for Advanced Equipment of Tsinghua University completed a signing ceremony. The two parties will engage in in-depth cooperation centered on “the development trends, forward-looking perspectives, and application prospects of atomic-level manufacturing processes for gallium nitride devices in humanoid robot joint modules,” marking the full launch of a strategic industry-university-research collaboration in the cutting-edge fields of gallium nitride chips, humanoid robot joints, and atomic-level manufacturing.
This cooperation represents another key step in Xingyuan JingSuan’s “industry-university-research-application” collaborative innovation system. The company will leverage Tsinghua University’s top-tier research capabilities in atomic-level manufacturing to accelerate the engineering application of gallium nitride power chips and driver chips in humanoid robot joint modules, injecting strong momentum into the material innovation and integration processes of core components.
Shi Rui, President of Xingyuan JingSuan, stated: “Gallium nitride chips are core devices for breaking through the power density bottleneck of humanoid robot joints. The Tianjin Research Institute for Advanced Equipment of Tsinghua University has world-class research expertise in atomic-level manufacturing and ultra-precision machining. Through this collaboration, we will establish a full chain from ‘chip design—atomic-level processes—joint module integration,’ providing fundamental solutions for the high dynamics and long endurance of humanoid robots.”
Dai Yuanjing, Executive Deputy Director of the Lubrication Technology Research Institute (centered on Academician Luo Jianbin’s team, focusing on superlubricity and atomic-level manufacturing frontiers) at the Tianjin Research Institute for Advanced Equipment of Tsinghua University, noted: “Atomic-level manufacturing technology has the potential to push the performance of semiconductor devices to physical limits. The cooperation with Xingyuan JingSuan will elevate the fabrication precision of gallium nitride power chips to the atomic level, while exploring system-level integration solutions in integrated joints. This holds significant demonstrative value for the large-scale application of wide-bandgap semiconductors in humanoid robots.”
The two parties will focus on three technical directions:
- Application solutions and development prospects of gallium nitride power chips and driver chips in integrated joint modules for humanoid robots;
- Exploration of atomic-level manufacturing processes and device physical limits for gallium nitride chips;
- Selection, heterogeneous integration, and system planning of gallium nitride chips tailored to the high power density requirements of humanoid robot joints.
This cooperation will significantly accelerate Xingyuan JingSuan’s breakthroughs in key technology areas such as wide-bandgap semiconductor power chips, high-power-density joints for humanoid robots, and atomic-level precision manufacturing, further solidifying the company’s technological barriers in next-generation computing power and robot hardware. Looking ahead, Xingyuan JingSuan will continue to deepen collaborative innovation with top-tier research institutions, tackling the “bottleneck” challenges of core chips and advanced manufacturing processes for humanoid robots, contributing to the high-end and autonomous development of China’s embodied intelligence and advanced semiconductor industries.
