TaipeiMay 19, 2026 /PRNewswire/ — Compal Electronics (Compal; Stock Code: 2324) will showcase next-generation integrated AI infrastructure solutions at COMPUTEX 2026, demonstrating the company’s expanding technical capabilities and strategic deployment in AI servers, liquid cooling, and data center infrastructure integration.
As AI workloads grow rapidly, the demand for high power consumption and high thermal density continues to drive requirements for data center power and cooling architectures. Compal has expanded beyond traditional server manufacturing to offer integrated AI infrastructure solutions, providing cloud service providers, enterprises, and large-scale AI Factories with more complete and rapidly deployable AI infrastructure platforms. Through collaboration with Exascale Labs, Compal further strengthens its integration capabilities in computing, cooling, and power infrastructure, helping customers build more scalable and efficient AI data center environments.
At this COMPUTEX exhibition, Compal will present a comprehensive AI infrastructure solution at its booth, integrating AI servers, liquid cooling, and data center infrastructure technologies. This includes Compal’s latest AI server platforms, such as the OG231-2-L1, SGX30-2, and OG430-2-L1, as well as cooling distribution unit (CDU) thermal technologies. Additionally, the on-site display will feature Exascale Labs’ modular data center (MDC) and HVDC power architecture technology based on solid-state transformers (SST), showcasing an integrated deployment capability that combines computing, cooling, and power infrastructure. This helps customers accelerate AI infrastructure adoption while enhancing system scalability and energy efficiency.
Through rack-scale computing platforms, liquid cooling, and flexible infrastructure integration capabilities, Compal can provide customized AI infrastructure deployment solutions tailored to different workloads, power supply conditions, and data center environmental requirements, further reducing deployment complexity and shortening construction timelines.
Chang Yao-wen, Vice President of Compal’s Infrastructure Business Group, stated: “The development of AI infrastructure is no longer just about competition in single server performance; customers increasingly need integrated solutions covering computing, cooling, and power. By combining Compal’s AI servers and liquid cooling technologies with Exascale’s modular infrastructure and HVDC capabilities, we can help customers deploy scalable AI infrastructure more quickly and efficiently.”
Dr. Hoansoo Lee, CEO of Exascale, said: “Market demand for more flexible and rapidly deployable AI infrastructure continues to grow. Through this collaboration with Compal, we are pleased to combine modular data centers and HVDC power technology with Compal’s integration capabilities in AI servers and liquid cooling, jointly showcasing next-generation AI infrastructure solutions suitable for high-density AI environments.”
Compal’s AI infrastructure display will be featured at booth M0804 during COMPUTEX 2026.
About Compal
Founded in 1984, Compal has developed into a leading manufacturer in the notebook computer and smart device industry, driven by a professional management team and strong R&D capabilities. The company collaborates across various sectors to create brand value, continuously innovating and forward-thinking to realize smart technology. Leveraging extensive industry experience, Compal provides high-quality services, and its groundbreaking product designs have repeatedly received international awards. In 2025, Compal was ranked among the top 7 manufacturing companies in Taiwan by CommonWealth Magazine and has been listed in Forbes’ Global 2000 for many years. In recent years, the company has actively expanded into emerging businesses, including cloud servers, automotive electronics, and smart healthcare, developing relevant solutions by leveraging its hardware-software integration and manufacturing strengths. The company is headquartered in Taipei and has manufacturing facilities in the United States, Taiwan, China, Vietnam, Mexico, Brazil, and Poland. For more information, please visit www.compal.com
About Exascale Labs
Exascale Labs is a next-generation AI infrastructure provider offering end-to-end solutions covering computing power, cooling, electricity, and deployment. Exascale Labs’ core products include GPU-as-a-Service (GPUaaS), providing customers with high-performance GPU computing power from around the world, along with cluster management and optimization services for AI data centers. The company also offers modular data centers (MDC), high-density cooling, solid-state transformer (SST)-based high-voltage direct current (HVDC) power, and energy storage solutions, aimed at addressing deployment bottlenecks in AI infrastructure. The company’s proprietary large-scale AI computing platform is designed for large language model (LLM) training, fine-tuning, and high-concurrency inference, helping enterprises and industry partners achieve AI empowerment and economic benefits faster and more efficiently.