Here’s a professional English translation of the Chinese title: **”3PEAK’s Full-Stack Analog Chip Solution for AI Data Centers: Building a Solid Foundation for Intelligent Computing”**

Leveraging its deep technical expertise in high-performance analog chips and a comprehensive product portfolio, 3PEAK has developed a complete analog chip solution for AI data centers, covering core computing units, data center power systems, and AIDC backup power BMS systems. Currently, 3PEAK serves over a hundred leading customers in mainstream AI servers, power modules, and energy storage backup sectors both domestically and internationally, achieving rapid revenue growth in the AI and data center fields, and is becoming a core supply force for domestic analog chips in the era of intelligent computing.

An AI data center is a complex system integrating computing power, power supply, and security protection. Its operational efficiency, stability, and safety directly determine the quality and continuity of intelligent computing services, making it crucial for the efficient operation of digital infrastructure. Analog chips serve as the “invisible cornerstone” ensuring the smooth operation of each component.

Schematic diagram of data center core components
Schematic diagram of data center core components

Core Computing Unit
Full-stack solution ensures efficient and stable operation of the computing engine

The core computing unit is the “computing engine” of an AI data center, encompassing CPU/GPU/AI accelerator chip clusters, memory support, board-level signal processing, and power distribution networks. Its primary responsibility is to maximize computing efficiency. This scenario imposes extremely stringent requirements on analog chips: ultra-high precision power supply monitoring, nanosecond-level signal response, extremely low noise interference, and long-term stability for 7×24-hour full-load operation. Even millivolt-level power fluctuations can cause computing chips to throttle, lead to operational anomalies, or even system crashes.

Functional block diagram of AI server motherboard
Functional block diagram of AI server motherboard

Detection and protection are vital for the stable operation of server motherboards. 3PEAK’s AFEs, ADCs, CSAs, comparators, and temperature sensors have been deeply embedded in the server industry for years, with mature application scenarios. In response to the 48V/54V high-voltage power supply requirements of AI servers, 3PEAK has specifically launched the TPA6271 AFE product for high common-mode voltage power detection and the TPA132 series CSA current-sense amplifier products, adapting to high-voltage power supply scenarios and building the first line of defense for stable server operation.

TPA6271 integrates a 16-bit ADC, supports a wide input voltage range of 0V to 102.4V, with a maximum offset voltage of ±10μV and a temperature drift of 0.025μV/℃. Optimized for high-precision current detection, it is specifically designed for high common-mode voltage power detection in AI server 48V/54V high-voltage input power supplies.

TPA183Ax is a high-precision, zero-drift CSA current-sense amplifier supporting a wide common-mode voltage range of 2.7V to 30V, with an offset voltage as low as 55μV. It offers four selectable fixed gains: 25V/V, 50V/V, 100V/V, and 200V/V, enabling accurate detection of current in the power bus.

TPA132Ax is a high common-mode voltage CSA current-sense amplifier supporting an ultra-wide common-mode voltage range of -4V to 80V and a high bandwidth of 1MHz. It also integrates enhanced PWM rejection capability, making it perfectly suitable for precise current detection in AI server 48V/54V high-voltage input scenarios.

Power management is the power source driving efficient server operation, requiring multi-rail differentiated power supply for the motherboard. 3PEAK has launched products such as POLs, LDOs, eFuses, power sequencing controllers, and power monitors, providing efficient and stable power solutions for server motherboards, helping the computing engine deliver sustained output.

TPP21206 adopts a self-developed fixed-frequency ACOT control architecture. While retaining the advantages of traditional COT control, it achieves a fixed operating frequency under varying input voltage (Vin), output voltage (Vout), and load conditions. Thoroughly tested across different duty cycles and full load conditions, the frequency remains stable under various operating scenarios, addressing the instability issue of COT architectures and significantly improving transient response and output ripple.

Interface chips serve as the “communication bridges” for interconnecting devices within the server. 3PEAK has built a complete I2C/I3C interface chip solution, comprehensively covering full-function scenarios including IO expansion, multi-master arbitration, multi-channel signal switching, hot-swap, level shifting, and signal repeating, breaking down barriers to device interconnection.

TPT29606 is a level shifter chip launched by 3PEAK for I3C applications. It can transmit both open-drain and push-pull signals, compatible with I2C and SPI scenarios. It supports a minimum supply voltage of 0.72V and a maximum data rate of 26Mbps, widely used in servers, routers, storage, PCs, and other fields.

Signal processing chips enable multi-channel signal switching, long-distance signal driving, level shifting, and logic function combination. 3PEAK has a complete logic product matrix, covering AHC, LVC, AUP, AVC, and other series, offering 2-8 bit fixed-direction and auto-direction level shifters, fully adapting to various signal processing needs in servers, ensuring accurate, efficient, and distortion-free signal transmission.

Function Category

3PEAK Representative Products

Detection & Protection


Power Detection AFE: TPA626, TPA6271, TPA6290

Analog-to-Digital Converter ADC: TPAFE0808, TPC502200

Current Sense Amplifier CSA: TPA183, TPA191, TPA132, TPA1285

Comparator: TPCMP271, TP1961, TP1941, LM393A

Temperature Sensor: TPTMP75

Power Management


POL: TPP21206

LDO: TPL9308, TPL9305, TPL9218

DDR VTT LDO: TPL51200

eFuse: TPS14P50, TPS05P50

Power Sequencing Controller: TPK1031, TPK1034

Monitor & Reset: TPV8308, TPV706

Interface

I2C IO Expander: TPT29555A, TPT29554A, TPT29508

I2C Arbiter: TPT29641

I2C Switch/Multiplexer: TPT29545, TPT29546L, TPT29548L

I2C Hot-Swap: TPT29511H

I2C Level Shifter & Repeater: TPT29617A, TPT29306

I3C Level Shifter: TPT29336, TPT29606

Signal Processing


Signal Switch: TPW3257, TPW3625, TPD160221

Video Buffer: TPF153

Level Shifter: TPT20104, TPT20108, TPT20204, TPT20208

Logic Products: Logic Gates, Buffers, Inverters, Shift Registers, Flip-Flops

3PEAK Core Computing Unit Product Solutions

Data Center Power System
Full-chain efforts empower efficient, energy-saving, stable, and reliable power systems

As the “energy artery” of an AI data center, the data center power system covers three core scenarios: PSU power modules, BBU battery backup units, and SST solid-state transformers. It spans the entire chain from medium-voltage to low-voltage power conversion, PFC power factor correction, isolated bidirectional DC/DC conversion, DC bus voltage regulation, and redundant protection. With current AIDC single-server power consumption exceeding 10kW and the rapid adoption of 800V high-voltage architectures, the power system demands higher performance from analog chips: high-frequency, high-efficiency power conversion, nanosecond-level transient response, strong anti-interference isolated driving, low EMI electromagnetic compatibility design, high reliability for redundant power supplies, while also meeting stringent energy efficiency standards and over 10-year long-life operation requirements.

Functional block diagram of PSU Power Module
Functional block diagram of PSU Power Module

In the gate driver product domain, 3PEAK’s high-current, low-latency low-side drivers and safety-standard-compliant isolated driver solutions help customers continuously optimize the power supply “powertrain”. While ensuring high reliability of AIDC power supply equipment, they effectively improve system operational efficiency, achieving efficient energy utilization.

TPM5355 is an enhanced isolated driver product with ±150-kV/μs CMTI capability. It integrates a Miller clamp function to address half-bridge cross-conduction and shoot-through issues, significantly enhancing the stability of half-bridge structures, providing a stable and reliable driving solution for power devices such as MOSFETs, SiCFETs, and IGBTs.

3PEAK’s power management products (DCDC/LDO/Voltage Reference) provide high-precision, highly stable power support for AIDC power supply equipment digital control ICs, ensuring long-term stable system operation. They also offer a variety of small-package product options suitable for high-density integration design requirements, helping customers achieve equipment miniaturization and lightweight upgrades.

TPP36308x and TPP36208x are 36V/3A and 36V/2A synchronous rectification Buck product series, respectively. They use low on-resistance MOSFETs to replace diodes, effectively reducing losses and improving efficiency. The product series includes four versions: corresponding to switching frequencies of 500kHz and 2.2MHz, with Current Mode options of Pulse-Skip and Forced-PWM.

3PEAK’s rich interface product portfolio can assist AIDC power supply equipment in achieving high-speed, lossless, low-latency communication, ensuring efficient coordinated operation of multiple modules like PSU, BBU, and SST, improving the response efficiency of the entire power system.

TPT1255 and TPT1256 are enhanced industrial-grade 5V CAN transceivers, supporting 5Mbps CAN FD. They feature high common-mode voltage, high voltage tolerance, and high ESD protection levels, with a VCC input voltage range of 4.5V-5.5V and support for 3.3V~5V VIO, meeting various industrial and communication application scenarios.

The TPT76XX series digital isolators provide electrical isolation strength up to 5000VRMS, effectively preventing high-voltage crosstalk and protecting low-voltage side equipment and personnel safety. The products also feature a high common-mode rejection ratio of 200kV/µs, significantly enhancing the reliability and safety of high-voltage systems in industrial, new energy, and automotive applications.

3PEAK deeply aligns with customer application needs, adheres to a differentiated technology roadmap, and continuously optimizes AIDC power supply system solutions. 3PEAK’s active filter chip TPAEF004x series can efficiently improve system EMI issues, while reducing common-mode choke size and further lowering overall system cost, helping customers achieve dual optimization of performance and cost.

Function Category

3PEAK Representative Products

High-Precision Voltage / Current Detection


OPA: TPA165x, TPA230x, TPA553x, TPA226x

CSA: TPA191, TPA132, TPA158

ISO-AMP: TPA8001, TPA8003, TPA80xx Series

Current Sensor: TPA850x Series

Gate Driver


Non-Isolated Driver: TPM27517, TPM27524, TPM27211, TPM27282

Isolated Driver: TPM23525, TPM5355, TPM21550

Power Management & Control

PWM Controller: CM2842, CM1763A, TPQ5055

Synchronous Buck: TPP36x08, TPP36308X, TPP00031

Isolated Power: TPM650x, TPQ5180

LDO: TPL8031, TPL820, TPL5031, TPL51117

Oring Controller: TPS65R01, TPS75R01

Monitor & Reset: TPV809, TPV6823

Interface & Digital Isolation


Digital Isolator: TPT76xx, TPT7641

CAN: TPT125x, TPT1057, TPT710xx, TPT71050

RS485: TPT487A, TPT487L1, TPT7487

RS232: TPT3232A

Signal Conditioning & Switching


Analog Switch: TPW405x Series, TPW4051

Comparator: LM393, LM339A, TPCMP27x Series, TPCMP217

Logic Devices: T74U1G08, T74U1G32, T74L8T245, T74A244, T74H540

System Safety & EMI Optimization


Active EMI Filter Chip: TPAEF0040, TPAEF0041

Temperature Sensor: TPTMP75

Power MOS: CMS60H12M, CMSH1080M

3PEAK Data Center Power System Product Solutions

AIDC Backup Power & BMS System
High-performance solutions build a solid safety and endurance line for intelligent computing

The AIDC backup power and BMS system serves as the “safety and endurance base” of an AI data center. Composed of lithium battery packs, a battery management system (BMS), and a power conversion system (PCS), it monitors the full lifecycle status of battery cells in real time. In the event of grid anomalies, it provides millisecond-level uninterrupted power supply, ensuring the continuity of core computing services—the final critical line of defense for data center safe operation. With the widespread adoption of 800V high-voltage DC architectures, the industry demands higher voltage accuracy, millisecond-level response speed, and insulation safety from BMS, directly driving a surge in demand for high-performance BMS solutions.

Block diagram of AIDC backup power and BMS system
Block diagram of AIDC backup power and BMS system

 

Function Category

Core Application Module

3PEAK Representative Products

BMS Analog Front End
(AFE)

AIDC Backup BMS Cell Voltage Acquisition, Balancing Control, Battery Protection

BMS AFE: TPB76016, TPB79818, TPB7717

High-Precision Analog-to-Digital Conversion
(ADC)

BMS High-Voltage & Insulation Monitoring, Bus Current Sampling, Temperature Acquisition

Σ-Δ ADC: TPC6160I, TPC6200S

SAR ADC: TPC5121

Power Management & Control

Auxiliary Power, Isolated Power, System Rail Management, Hot-Swap Protection

Buck: TPP36308, TPP15051

Isolated Power: TPM6501

Flyback: TPQ5180

LDO: TPL8031, TPL5031

Interface & Digital Isolation

High-Voltage Side & Low-Voltage Side Digital Isolation, BMS Master-Slave Device Communication

Digital Isolator: TPT7641

CAN: TPT125x, TPT71050

RS485: TPT487L1, TPT7487

Signal Conditioning & Switching

Multi-Channel Temperature Monitoring, BMS Multi-Cell Signal Round-Robin Monitoring

Analog Switch: TPW4051

3PEAK AIDC Backup Power & BMS System Product Solutions

Full-Stack Analog Chip Power, Solidifying the New Foundation for Intelligent Computing

The computing power race in AI data centers is essentially an ultimate competition in the performance and reliability of underlying core components. 3PEAK has achieved deep, full-category deployment in areas such as operational amplifiers, voltage references, ADCs, BMS AFEs, isolators, interface chips, power management, and gate drivers. It provides a one-stop, high-performance analog chip solution for AI data centers, covering the entire chain from signal sensing, processing, and transmission to power driving, comprehensively supporting the development of the intelligent computing industry.

From precision power supply monitoring for core computing units, to efficient power conversion in PSUs and SSTs serving as the energy artery, to full lifecycle safety assurance for backup power systems, 3PEAK continuously innovates technologically to solidify the underlying hardware foundation for the intelligent computing era. Leveraging its portfolio of over 3,200 products across the full chain, stringent quality standards, an independently controllable testing system, and supply chain advantages, 3PEAK is striving to become a globally leading core analog chip supplier in the AI and data center fields, continuously injecting core momentum into the high-speed development of the digital economy and intelligent computing industry.

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