Dymax Expands HLC™ Product Line with New Low-Viscosity Medical Light-Curable Instant Adhesive HLC-M-1004

–Enables stable curing in both light-exposed and shaded areas

ShenzhenMay 28, 2026 /PRNewswire/ — Dymax, a leading manufacturer of rapid curing materials and equipment, today officially launched the HLC‑M‑1004 low-viscosity light-curable instant adhesive, specifically designed for efficient assembly of complex medical devices.

The introduction of HLC‑M‑1004 further expands the Dymax HLC™ light-curable instant adhesive product line. Leveraging a unique curing mechanism, this series achieves curing in both light-exposed and shaded areas: instant contact curing in shaded regions, and rapid light curing under low-intensity UV or visible light, ensuring efficient and smooth production processes.

HLC‑M‑1004 is developed specifically for medical device assembly applications, widely suitable for bonding components in catheters, diagnostic and therapeutic equipment, and various parts using opaque or light-blocking substrates. Its low viscosity facilitates precise dispensing and easy penetration into narrow bonding gaps, forming a uniform and strong adhesive layer without the need for primer treatment.

The material also offers multiple additional performance advantages, including effectively reducing “blooming” under appropriate light curing conditions, maintaining good flexibility after curing, and achieving an overall improved appearance. It enables rapid positioning and curing, meeting the high-throughput, assembly-line production demands of medical devices.

HLC‑M‑1004 has been rigorously tested in compliance with ISO 10993 biocompatibility standards and is formulated without non-reactive solvents. As a single-component adhesive, it requires no mixing and is ready for immediate application, helping manufacturers simplify production processes, reduce material waste, and enhance overall production efficiency.

With the launch of HLC‑M‑1004, Dymax continues to enrich its HLC™ light-curable instant adhesive product line to address the evolving bonding challenges and process complexities in medical device assembly environments.