– New design tailored to semiconductor wafer shape
– Simplifies pressure measurement steps during wafer bonding
ShanghaiJune 17, 2026 /PRNewswire/ — On June 8, 2026, FUJIFILM Corporation announced the launch of “Circular Prescale.” This product features a circular design matching the shape of semiconductor wafers and belongs to the pressure measurement film “Prescale”*1 series.
FUJIFILM’s “Prescale” series is a film that easily measures contact pressure, pressure uniformity, and pressure distribution between surfaces. When pressure is applied, the film turns red, allowing users to intuitively gauge pressure levels based on color depth. As a result, “Prescale” is widely used in R&D and manufacturing processes across industries such as displays, electronic components, automotive, batteries, and packaging.
Structure of “Prescale” (two-sheet type) When pressure is applied, microcapsules in the color-forming layer rupture, releasing colorless dye. When the dye contacts the developer, a chemical reaction occurs, turning the film red.
In recent years, in the semiconductor field, as manufacturing processes become increasingly precise, the importance of pressure detection during manufacturing has grown. With the advancement of artificial intelligence (AI) and next-generation communication technologies, semiconductors are moving toward miniaturization and stacking technologies. In processes such as “wafer bonding,” which connects wafers or chips, requirements for bonding precision and stability are becoming stricter. Even slight pressure variations can affect semiconductor performance, leading to a growing demand for high-precision detection of pressure uniformity during bonding.
FUJIFILM’s newly launched “Circular Prescale” is specifically designed for 12-inch (φ300 mm) wafers, the industry standard in current semiconductor manufacturing. Since it does not need to be cut to match the wafer’s size or shape during inspection, the product improves inspection efficiency and reduces labor requirements. Additionally, because “Circular Prescale” supports direct pressure measurement in high-temperature environments up to 220°C, it enables accurate pressure measurement even when equipment is heated.
Furthermore, the pressure image analysis software “FUJIFILM Prescale Mobile (Prescale Mobile)”*2 also supports “Circular Prescale.” This software captures the color-developed image of “Prescale” using a mobile device and performs numerical analysis. Additionally, the dedicated device for “Prescale,” “FUJIFILM Prescale Station” (“Prescale Station”)*3, is also planned to support “Circular Prescale” from July this year. This device uses a high-resolution FA camera (Factory Automation Camera) to read the color-developed image of “Prescale” and perform numerical analysis.
FUJIFILM supports customers in improving and stabilizing manufacturing quality by developing and providing products that digitize and simplify inspection operations in product R&D and manufacturing sites.
“Pressure Image Analysis Device” (left) and “Pressure Image Analysis Software” (right) can be used for quantitative pressure analysis (“Pressure Image Analysis Device” is planned to support “Circular Prescale” from July)
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*1 A film that utilizes FUJIFILM’s precision coating and microcapsule technology to easily visualize pressure, pressure uniformity, and distribution. Depending on the measured pressure, “Prescale” comes in two types: a two-sheet type (with color-forming agent and developer coated on different substrates) and a single-sheet type (with both coated on the same substrate). “Circular Prescale” is of the two-sheet type. |
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*2 A mobile application software that uses FUJIFILM’s image processing technology to quantify pressure from the color-developed image of “Prescale.” By placing the developed “Prescale” on a dedicated calibration sheet and scanning it with a mobile device running the app, users can easily obtain 13 types of pressure data, including maximum/minimum pressure, average pressure, and pressure area. Its simple workflow helps users perform high-precision pressure detection with ease. *3 A dedicated pressure image analysis system for analyzing the color-developed image of “Prescale” and quantifying pressure. |
1. Product Name, Release Date, Price, Specifications
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*4 Recommended temperature for double-sided heating of the bonding surface. |
2. Key Features of “Circular Prescale”
(1) Circular design tailored to wafer shape, improving work efficiency
“Circular Prescale” is designed specifically for the 12-inch (φ300 mm) wafer shape, reducing the time and labor required for pressure measurement preparation. Additionally, the product comes with a handle for gripping, avoiding contact with the pressure measurement surface, which helps improve work efficiency in semiconductor manufacturing environments.
[Workflow for “Circular Prescale”]
1. Remove “Circular Prescale” from the packaging box.
2. Overlap the A film and C film.
3. Insert the overlapped “Circular Prescale” between the surfaces to be measured and apply pressure.
4. Visually confirm pressure uniformity using a color comparison chart and calibration curve.
(2) Supports pressure measurement in high-temperature environments
The “Circular Prescale” series includes models capable of pressure measurement in high-temperature environments ranging from 35°C to 150°C and 150°C to 220°C. Users can select the appropriate product model based on their specific operating conditions.
(3) Use with quantitative analysis tools to further improve pressure measurement quality
“Circular Prescale” can also be used in conjunction with “Prescale Mobile.” This tool quantifies pressure values by analyzing the color-developed image of “Circular Prescale.” Its simple workflow helps users easily quantify pressure uniformity, thereby improving inspection efficiency and strengthening quality control. Additionally, the pressure image analysis device “Prescale Station,” dedicated to “Circular Prescale,” is also planned to support “Circular Prescale” from July this year.