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- Arm AGI CPU-based platforms enhance performance per watt for modern workloads
- High-density liquid cooling systems accelerate HPC and AI workloads
- Flexible infrastructure supports agentic AI in cloud and enterprise environments
San Jose, CaliforniaApril 29, 2026 /PRNewswire/ — Super Micro Computer, Inc. (NASDAQ: SMCI), a provider of comprehensive AI, enterprise, storage, and 5G/edge computing solutions, today announced an expansion of its Data Center Building Block Solutions (DCBBS) portfolio, introducing new Arm® architecture server platforms powered by the new Arm AGI CPU, along with new rack solutions compliant with the Open Compute Project (OCP) ORv3 standard. Supermicro leads the industry with over 20 OCP Inspired™ systems, integrating a variety of OCP technologies and form factors to simplify open data center deployment.

DCBBS for Next-Generation HPC and AI Infrastructure
“Supermicro is continuously advancing DCBBS by expanding our Arm architecture platforms and OCP system portfolio to serve next-generation AI and HPC demands,” said Charles Liang, President and CEO of Supermicro. “With high-density liquid cooling systems and energy-efficient Arm architecture, we can build scalable, flexible data centers that maximize performance per watt and accelerate AI adoption in cloud and enterprise environments.”
DCBBS provides complete, modular AI infrastructure. Built on proven components and subsystems, it offers end-to-end deployment flexibility from individual GPUs and network switches to full racks, site infrastructure, management software, and professional services.
“The rapid growth of AI is reshaping data center infrastructure requirements,” said Mohamed Awad, Executive Vice President of Arm’s Cloud AI Business Unit. “The Arm AGI CPU platform, built on Arm Neoverse technology, lays the foundation for a new generation of computing. Our collaboration with Supermicro brings these capabilities to market in flexible, high-density systems optimized for modern AI and cloud environments.”
“By integrating the energy-efficient Arm Neoverse platform into Supermicro’s ORv3 portfolio, the OCP Community is expanding the open supply chain for AI infrastructure,” said Steve Helvie, Chief Emerging Ecosystem Officer at the OCP Foundation. “This collaboration provides modular, liquid-cooled building blocks that help the entire ecosystem scale high-performance, energy-efficient data centers.”
Supermicro’s expanded OCP ORv3 portfolio includes new rack configurations and dedicated servers designed for seamless integration and handling high-performance workloads. A new 2U GPU system, compatible with 21-inch OCP ORv3 racks, features dual Intel® Xeon® 6 6700 series processors (with P-Cores), a 1400A busbar inspired by OCP with power shelves, and supports DC-SCM. This system integrates the NVIDIA HGX™ B300 8-GPU platform with fifth-generation NVLink®, providing the compute density and bandwidth required for large-scale AI deployments. For more information, click here.
Additionally, for ORv3 environments, Supermicro has introduced the FlexTwin™ system. This is a high-density dual-node platform that integrates two independent servers in a 1-OU chassis. Designed for HPC and AI workloads, it supports the latest Intel processors as well as future Intel and AMD CPUs. The FlexTwin employs Supermicro’s DLC-2 liquid cooling solution for CPU, memory, and VRM cooling—eliminating up to 90%* of system-generated heat. For more information, click here.
At the same time, Supermicro has launched two new Arm architecture systems based on the recently released Arm AGI CPU, available in 2U and 5U form factors. They feature high core density, expanded memory capacity, and flexible I/O configurations, enabling the construction of energy-efficient, scalable agentic AI infrastructure.
System Overview:
- Compact 2U Server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse® V3 cores
- 24 DIMM slots, supporting up to 6TB DDR5 memory
- 8 front hot-swappable 2.5-inch NVMe drive bays
- Details click here
- Expanded 5U Server
- Arm AGI CPU with 64, 128, or 136 Arm Neoverse V3 cores
- 24 DIMM slots, supporting up to 6TB DDR5 memory
- 8 front hot-swappable 2.5-inch NVMe drive bays
- Additional PCIe lanes to increase GPU count in I/O-rich configurations
- Details click here
Supermicro encourages employees to volunteer with the Open Compute Project Foundation, and the company holds a seat on the OCP Advisory Board. Click here to learn more about how Supermicro supports OCP events and initiatives.
*Based on Supermicro’s estimates
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in application-optimized total IT solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering market-first innovation for enterprise, cloud, AI, and 5G telecom/edge IT infrastructure. We are a comprehensive IT solutions provider offering servers, AI, storage, IoT, switch systems, software, and support services. Supermicro’s expertise in motherboard, power, and chassis design further drives our own R&D and production, enabling next-generation innovation from cloud to edge for global customers. Our products are designed and manufactured in-house in the US, Asia, and the Netherlands, achieving scale and efficiency through global operations while optimizing processes to reduce total cost of ownership (TCO) and environmental impact (Green Computing). The award-winning Server Building Block Solutions® portfolio allows customers to optimize for their specific workloads and application needs, selecting from our flexible and reusable building block system that supports a broad range of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air conditioning, natural cooling, or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
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