Here is a polished English translation of the Chinese title: **Innovation and Efficiency Gains Pay Off: JCET Reports 42.7% YoY Increase in Net Profit Attributable to Shareholders in Q1 2026**

In 2026, JCET Group, guided by its operational theme of “Innovation for Efficiency, Deepening for the Long Haul,” accelerated the transformation of R&D achievements, continued to scale up high-end production capacity, steadily expanded its customer base, and effectively drove a comprehensive improvement in both business scale and profitability. By application area, computing electronics-related business maintained the rapid growth momentum seen since 2025, posting a 14.2% year-on-year increase in the first quarter of this year. JCET Microelectronics (Jiangyin) Co., Ltd., which serves high-value-added fields such as high-performance computing chips, achieved stable mass production while actively responding to strong customer demand by expanding high-end advanced packaging and testing capacity. Additionally, the company’s automotive electronics business sustained high-speed growth, with revenue up 28.8% year-on-year during the reporting period. With the official launch of JCET Automotive Electronics (Shanghai) Co., Ltd., the company accelerated product introduction and mass production in cutting-edge areas such as intelligent driving, embodied intelligent robotics, and power management, further refining its capacity and delivery systems in high-end application fields. Other domestic factories operated at full capacity and steadily advanced expansion plans; factories in South Korea and Singapore successfully introduced new products from multiple major international customers, accelerating business structure optimization and upgrading, with broad growth prospects for the full year.

Meanwhile, JCET continued to strengthen its engineering R&D capabilities and infrastructure in key technology areas. In the first quarter of this year, the JCET Zhangjiang R&D Building in Shanghai was officially put into use, equipped with core R&D facilities such as a chip performance laboratory, providing solid support for the company’s R&D efforts, technology validation, and talent development.

Mr. Zheng Li, Director and CEO of JCET Group, stated: “Together with other major global packaging leaders, JCET is responding to market demand by fully advancing into wafer-level and system-level advanced packaging, along with supporting high-end testing, injecting strong momentum into the development of the integrated circuit finished product manufacturing industry. At this critical juncture, where advanced packaging technology shoulders the responsibility of bridging the past and future, and mainstream packaging businesses accelerate structural transformation toward advanced technologies, JCET is firmly committed to dual investments in high-end manufacturing capacity and advanced process R&D. We are dedicated to providing a solid platform for production and technological service innovation to our hundreds of high-quality customers across diverse market segments.”

Click to view: Jiangsu Changjiang Electronics Technology Co., Ltd. 2026 First Quarter Report

About JCET Group:

JCET Group is a globally leading provider of integrated circuit manufacturing and technology services, offering comprehensive, one-stop chip finished product manufacturing solutions to semiconductor customers worldwide. These services encompass microsystem integration, design simulation, wafer probing, chip and device packaging, final testing, product certification, and global direct shipping. The company operates eight production bases in China, South Korea, and Singapore, with over 20 business offices worldwide, providing customers with close technical collaboration and efficient supply chain support.

JCET Group possesses advanced and comprehensive chip finished product manufacturing technologies, including wafer-level packaging (WLP), 2.5D/3D packaging, system-in-package (SiP), flip-chip packaging, wire bonding packaging, and mainstream packaging advanced solutions. These are widely applied in fields such as automotive electronics, artificial intelligence, high-performance computing, high-density storage, network communications, smart terminals, industrial and medical sectors, and power and energy.

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