ShanghaiApril 26, 2026 /PRNewswire/ — On April 24, Black Sesame Technologies held a press conference titled “Connecting Everything with Chips, Empowering All Domains with Intelligence” at the 2026 Beijing Auto Show. Feng Chao, Chief Engineer of Intelligent Technology at the R&D Institute of Dongfeng Motor Group, and Gao Wei, Vice President of Sales at Black Sesame Technologies, engaged in a dialogue on-site, announcing a deep platform-level cooperation between Black Sesame Technologies and Dongfeng Motor to jointly develop the first localized cockpit-driving integrated mass-production platform—Tianyuan Smart CockpitPlus.
The Tianyuan Smart Cockpit Plus, as the flagship platform of the Tianyuan Smart Cockpit series, is powered by Black Sesame Technologies’ Wudang C1296 chip, supporting smart cockpit, L2+ driving assistance, and FAPA parking functions on a single chip. The Tianyuan Smart Cockpit Plus will first be deployed in Dongfeng’s benchmark model, the Dongfeng Yipai 007, and is planned for large-scale application across multiple production models from 2026 to 2027.
At the press conference, Feng Chao stated: “Dongfeng’s Tianyuan Smart Cockpit Plus selected the Wudang C1296 chip primarily because the C1296 enables single-chip support for integrated cockpit, driving, and parking capabilities, significantly enhancing system integration and response efficiency. Leveraging Dongfeng’s Tianyuan architecture and Tianyuan OS, the Tianyuan Smart Cockpit Plus will deliver a ‘always fresh, always new’ user experience.”
Gao Wei, Vice President of Sales at Black Sesame Technologies, explained: “As the first localized mass-production chip for cockpit-driving integration, the Wudang C1296 chip provides core computing power support for the Tianyuan Smart Cockpit Plus. In 2023, Black Sesame Technologies launched the Wudang C1200 family, becoming the industry’s first intelligent vehicle cross-domain computing chip platform. The Wudang C1296 chip offers extreme cost-effectiveness and extreme integration, helping to deliver an ultimate intelligent driving experience.”
The Tianyuan Smart Cockpit Plus will bring users an upgraded experience in two major scenarios: smart cockpit and intelligent driving. On the smart cockpit front, the Tianyuan Smart Cockpit Plus redefines the cockpit interaction experience through 3D immersive interaction, AI intelligent interaction, and full-scenario connectivity. On the intelligent driving front, with its multimodal perception fusion capabilities, the Tianyuan Smart Cockpit Plus meets L2+ full-scenario driving needs, complemented by FAPA fusion automatic parking and PDC parking distance control, achieving comprehensive coverage of core safety scenarios for both driving and parking.
The C1296 chip is manufactured using a 7nm automotive-grade process, achieving hardware-level fusion of four domains—cockpit, intelligent driving, gateway, and MCU vehicle control—on a single chip. With self-developed NPU and ISP as its core, it provides a rich array of sensor interfaces, high- and low-speed vehicle body interfaces, various display output interfaces, and 10-gigabit Ethernet interfaces, fully supporting cross-domain integration of smart cockpit, intelligent driving, and intelligent gateway. Additionally, the Wudang C1296 chip has passed ISO 26262 functional safety’s highest level, ASIL-D certification, providing a solid guarantee for the stable operation of the entire vehicle.
Through this platform-level cooperation with Dongfeng, Black Sesame Technologies leverages high-performance and systematic solutions to support Dongfeng’s global vehicle layout; uses high efficiency and cost-effectiveness to drive cockpit-driving integration from high-end exclusivity to mass adoption; and builds an intelligent ecosystem with a unified human-machine interface, promoting a high-quality transformation from feature stacking to deep experiential integration. Black Sesame Technologies will continue to deepen cooperation with industry chain partners like Dongfeng Motor, jointly driving the evolution of automobiles into sustainable, intelligent terminals.