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ShanghaiJune 5, 2026 /PRNewswire/ — From June 4-5, the 2026 Qualcomm Automotive Technology and Cooperation Summit, themed “Embarking on a New Journey with Intelligence,” was grandly held at the Wuxi International Conference Center. Global OEMs, Tier 1 suppliers, and leading companies across the industry chain gathered to explore new trends in the intelligent automotive sector. Quectel, as a long-term strategic partner of Qualcomm, deeply participated in this summit with its full range of in-vehicle intelligent solutions, systematically presenting its end-to-end capabilities from product R&D to intelligent manufacturing across three dimensions: computing power foundation, AI brain, and perception connectivity.
At the event, Meng Pu, Chairman of Qualcomm China, delivered a speech. Meng Pu noted that automobiles are evolving from mere modes of transportation into highly intelligent, continuously evolving mobile spaces, and will further become one of the most important mobile carriers for AI agents, capable of sensing the environment, understanding users, and coordinating services. 2026 has entered the “Year of the AI Agent,” where AI agents are driving human-machine interaction and device collaboration to a new stage. With cross-tier system capabilities spanning from terminals to data centers, Qualcomm makes intelligence ubiquitous and accessible. Going forward, Qualcomm will continue to collaborate with China’s automotive ecosystem partners, leveraging the Snapdragon Digital Chassis to jointly embark on a new journey of automotive intelligence.
Photo: Wang Min, General Manager of Quectel’s Automotive Front-Loading Business Unit and President of Ruiyuan Zhixing
Wang Min, General Manager of Quectel’s Automotive Front-Loading Business Unit and President of Ruiyuan Zhixing, delivered a keynote speech titled “Cabin-Connectivity Integration × AI-Driven: Redefining the Cockpit Ecosystem and Human-Vehicle Relationship.” Wang Min stated: “The industry has fully entered the AI-native era, and automobiles are evolving into the largest mobile intelligent terminals. The implementation of AI agents and the large-scale mass production of cabin-connectivity integration have become irreversible industry trends. Quectel and Qualcomm have always maintained strategic alignment, from early cellular communication connectivity to today’s integrated cabin-connectivity solutions and the deployment of large AI models in vehicles, jointly driving the deep implementation of leading connectivity and computing technologies in the automotive sector. Leveraging Quectel’s deep expertise in the automotive field and its full-stack capabilities in hardware-software integration, we will work with Qualcomm and global ecosystem partners to reshape the human-vehicle relationship with AI and usher in a new era of smart mobility.”
Computing Power Foundation: Cabin-Connectivity Integration, Covering All Vehicle Model Needs
In response to the current industry trend of cross-domain integration of cockpits, T-BOX, and intelligent driving domains, Quectel has developed a matrix of cabin-connectivity integration solutions ranging from entry-level to flagship, based on Qualcomm’s different-tier chips, effectively addressing the pain points of OEMs in developing multiple vehicle model platforms simultaneously. Currently, several cabin-connectivity integration solutions have been successfully implemented in mass production projects for leading OEMs and Tier 1 suppliers.
For different market segments, Quectel offers flexible and diverse cabin-connectivity solution combinations: the high-end AS830M (based on Qualcomm QCM8538), with 48 TOPS of computing power, enables smooth local deployment of large models, precisely targeting mainstream mid-to-high-end vehicles; the AS700E (based on Qualcomm QCM6650) targets the economy vehicle market, accelerating the popularization of intelligent cockpit accessibility.
Additionally, Quectel is developing more cabin-connectivity solutions based on chips like the Qualcomm QCS9075, continuously expanding its product matrix and enriching OEMs’ selection options. The intelligent cockpit digital solution built on this computing power foundation features four key characteristics: lightweight architecture, strong synergy, high compliance, and fast delivery. It supports multiple operating systems, multi-screen displays with different content, concurrent multi-camera feeds, and integrates practical functions such as quick-start reverse camera and smartphone-vehicle connectivity, comprehensively enhancing the user cockpit experience.
AI Brain: On-Device Large Models + Memory Engine, Making the Car Understand You Instantly
Leveraging Qualcomm’s heterogeneous NPU computing power foundation, Quectel has launched a scalable on-device AI large model solution for vehicles. Through deep optimization of heterogeneous computing power and coordination of CPU/GPU/NPU, the solution supports model fine-tuning for in-vehicle scenarios and parallel operation of multiple large models. It is fully compatible with mainstream large models such as Tongyi Qianwen, DeepSeek, and Llama, and features full-voice multimodal interaction, delivering an ultra-fast and smooth human-vehicle interaction experience.
A key highlight of the solution is Quectel’s self-developed memory engine, which intelligently filters and structurally stores driving and riding data, reducing token consumption and significantly improving retrieval efficiency. With human-like adaptive capabilities, the memory engine can accurately record the personalized driving habits of different occupants, achieving automatic adaptation the moment the occupant switches, upgrading the cockpit from passive command response to an immersive intelligent space capable of autonomous learning and proactive prediction.
Perception and Connectivity: Full-Scenario Networked Ecosystem, Building a Connected World
In the field of in-vehicle connectivity and environmental perception, Quectel continues to iterate cutting-edge automotive-grade technologies, with a product portfolio spanning the full spectrum from LTE Cat 4 to 5G R18 5G-A. Among these, the upcoming next-generation 5G R18 NAD product enables high-bandwidth, ultra-low-latency transmission in vehicles; the mass-produced C-V2X facilitates multi-dimensional coordination between “vehicle-to-vehicle,” “vehicle-to-infrastructure,” and “vehicle-to-pedestrian,” combined with centimeter-level high-precision positioning through multi-system fusion, fully empowering key scenarios such as advanced intelligent driving, automatic parking, and V2X warnings.
At the exhibition, NIO’s full-scenario technology flagship SUV ES8 and technology executive flagship SUV ES9 made a joint appearance. Both models are equipped with Quectel’s AG591E automotive-grade 5G module based on the Snapdragon Automotive Platform, vividly demonstrating the deep integration of high-end mass-produced vehicles with leading communication technologies. Additionally, the Li Auto L9 Livis, equipped with Quectel’s automotive-grade 5G-A module AG591H, made a stunning debut, supporting automotive-grade dual SIM dual active, delivering a smooth intelligent cockpit and stable, reliable in-vehicle connectivity experience.
Around connectivity and perception, Quectel has simultaneously implemented ten in-vehicle solutions, including digital keys, millimeter-wave radar, and smart antennas, creating an integrated architecture of “cellular communication + direct connectivity + high-precision positioning + environmental perception.” This builds a comprehensive full-scenario perception and connectivity ecosystem, solidifying the foundation for vehicle-to-everything coordination and advanced driver assistance systems.
Facing the AI-native era, Quectel will continue to advance alongside Qualcomm and global automotive ecosystem partners, leveraging its full-chain innovation capabilities from connectivity and cockpit to intelligent decision-making, driving the automotive industry’s transition from “transportation tools” to “intelligent mobile spaces,” and co-creating an infinite future for AI-powered mobility.
About Quectel
Shanghai Quectel Communication Technology Co., Ltd. (Stock Code: 603236) is a globally leading provider of comprehensive IoT solutions, offering a complete range of IoT products and services. These include hardware products such as cellular modules (5G/4G/3G/2G/LPWA), automotive front-loading modules, smart modules (5G/4G/edge computing), short-range communication modules (Wi-Fi & BT), GNSS positioning modules, satellite communication modules, and antennas, as well as services and solutions like AI solutions, IoT platforms, industrial intelligence, smart agriculture, certification and testing services, and RTK network correction solutions. With extensive industry experience, the company’s products are widely used in fields such as smart transportation, smart energy, financial payment, smart cities, wireless gateways, smart agriculture & environmental monitoring, smart industry, smart living & healthcare, and smart security. For more information, please visit Quectel’s official website at https://www.quectel.com.cn/, follow the WeChat public account/video channel “Quectel,” or send an email to marketing@quectel.com.