~ Creating Next-Generation Power Solutions ~
ShanghaiMay 27, 2026 /PRNewswire/ — USI, a global leader in electronic design and manufacturing services, today announced a major breakthrough in advanced power semiconductor packaging technology for next-generation power solutions. Leveraging exceptional substrate and module integration capabilities, USI has successfully embedded silicon carbide (SiC) dies into a multi-layer ABF substrate and innovatively adopted Single-Sided Copper Exposed (SSC) module packaging technology. This enables the integration of ceramic insulated substrates and wireless bonding processes into industry-standard power packages.
USI Power Module – SiC Chip Embedded Substrate
This innovative design represents a significant technological breakthrough for internally insulated power discrete devices. The package itself provides excellent electrical insulation while simultaneously offering low stray inductance and extremely low on-resistance. In response to the urgent market demand for high efficiency, superior heat dissipation, and high power density, USI’s chip-embedded packaging technology significantly reduces conduction losses, minimizes heat accumulation, and enhances long-term operational reliability compared to traditional packaging solutions. By integrating a ceramic substrate internally, the package delivers stable electrical insulation without relying on external insulating materials. Meanwhile, the innovative wireless bonding process allows for larger chips within a thinner package, further increasing power density and enabling the realization of highly integrated system designs.
“As power platforms continue to evolve toward higher efficiency and power density, the importance of advanced packaging technology in enhancing overall system performance becomes increasingly evident,“ said Chen Zhiyu, Senior Director of the New Product Introduction Center at USI. “By integrating SiC/GaN chip-embedded substrates, ceramic insulated substrates, and wireless bonding processes into industry-standard power packages, USI is driving the development of a new generation of power packaging solutions that combine thinness, high efficiency, and high reliability. We are actively expanding into diverse application areas such as electric vehicles, AI data centers, and humanoid robots.“
USI noted that the synergistic effect of low stray inductance, low on-resistance, and efficient heat dissipation significantly improves energy conversion efficiency and product reliability. This technological breakthrough will drive the automotive and industrial markets to accelerate toward next-generation, higher-efficiency electrification platforms.
In addition to power modules, USI also offers a one-stop service covering design to mass production for automotive powertrain systems, including high-density 400V/800V inverter systems, intelligent Battery Disconnect Units (iBDU), and Xin1 system solutions integrating OBC and DCDC converters. Combining advanced engineering, PCBA, and system assembly capabilities, USI provides customers with complete solutions from product development to large-scale production.
USI will participate in PCIM Europe 2026, held in Nuremberg, Germany, from June 9 to 11, 2026, showcasing its latest chip-embedded packaging technology, advanced power modules, and system integration solutions at Booth Hall 4-158. Industry partners are warmly invited to meet with USI experts to gain in-depth insights into how advanced packaging technology brings higher efficiency and reliability to applications such as electric vehicles, AI data centers, and humanoid robots, and to explore how USI’s one-stop design-to-mass-production services accelerate product development and shorten time-to-market.
USI is a global leader in electronic design and manufacturing and holds a leading position in the SiP (System-in-Package) field. USI’s operational production service sites span Asia, Europe, the Americas, and Africa, providing brand customers worldwide with comprehensive D(MS)2 services, including electronic product Design, Manufacturing, Miniaturization, industry-specific hardware and software Solutions, as well as material procurement, logistics, and maintenance Services. USI is a member of the ASE Group (TWSE: 3711, NYSE: ASX). For more information, please visit www.usiglobal.com or follow us on WeChat (account: USI).