MWC26 Shanghai | Quectel Unveils Its First MediaTek-Powered Flagship AI Computing Module

ShanghaiJune 25, 2026 /PRNewswire/ — On June 25, during the MWC26 Shanghai exhibition, Quectel officially launched its first flagship AI computing module based on the MediaTek platform, the SP805FL series (including WF and AP versions), unlocking the key pathway for high-level AI computing power to penetrate into various industries at the edge.


Powered by the MediaTek flagship chip Genio Pro 5100, this product integrates powerful computing capabilities, outstanding graphics and imaging performance, and a rich set of interfaces, fully supporting the deployment of physical AI, on-device large language models, and multimodal interaction. It is widely applicable to high-end scenarios such as robotics, smart helmets, 3D scanning/printing, computing boards, smart retail, large-screen displays, and smart homes, helping customers seize opportunities in the wave of edge computing and AI-native applications.


Wang Zhenguo, General Manager of the MediaTek IoT Business Unit, stated: “Quectel is a long-term trusted strategic partner of MediaTek. It is significant that Quectel is among the first customers to deeply participate in the joint development of the MediaTek Genio Pro flagship platform. Leveraging MediaTek’s leading AI computing power and multimedia capabilities, combined with Quectel’s deep technical expertise and global presence, the jointly developed SP805FL series can precisely serve high-end customers worldwide with a strong demand for high computing power, multiple interfaces, and Linux systems. This is not only another breakthrough in our technical collaboration but also lays a solid foundation for future deep cooperation in cutting-edge fields such as high-end smart modules and on-device AI.”

Zhang Dong, COO of Quectel, stated: “On-device AI is reshaping the boundaries of the IoT, and AI computing modules are the core foundation of this transformation. Quectel has deeply collaborated with MediaTek to introduce the MediaTek Genio Pro flagship platform into Quectel’s high-computing module series for the first time, creating the SP805FL series. It is not only a significant extension of Quectel’s high-end product line but also a starting point for jointly defining a new standard of ‘AI + Connectivity.’ In the future, we will continue to resonate with MediaTek in cutting-edge directions such as on-device large models and physical AI, providing the most competitive AI computing solutions for global customers.”

Flagship CPU Architecture: Effortlessly Handling Complex Tasks at the Edge

The SP805FL features a full octa-core Arm v9.2 architecture, consisting of 1×Cortex-X925 + 3×Cortex-X4 + 4×Cortex-A720, paired with a 3nm process, easily handling multitasking and complex computations.

In practical applications, when a robot simultaneously performs navigation calculations, visual recognition, and voice dialogue, it can maintain smooth responses, eliminating lag and latency. For devices such as industrial tablets and 3D scanners that need to process massive amounts of data in real-time, the powerful performance redundancy makes “millisecond-level reconstruction” a reality.


50+ TOPS NPU: Achieving Pure On-Device AI Independent Operation

The deployment of on-device AI relies on dedicated AI computing power support. The SP805FL integrates MediaTek’s 8th-generation NPU, with AI computing power reaching 50+ TOPS, supporting INT4/INT8/INT16/FP16 full-precision calculations. It can efficiently deploy various AI large models, possessing multimodal interaction and scene perception capabilities, providing strong support for the large-scale deployment of on-device AI.

Relying on its powerful AI performance, devices can independently complete complex AI inference tasks. Whether it’s smart helmets used in underground or field operations, service robots, or smart retail terminals, they can operate stably in disconnected or congested network environments, responding to commands in milliseconds while protecting data privacy.

Full-Scene Multimedia and Connectivity Capabilities: Adapting to Demanding Industrial Requirements

In terms of multimedia capabilities, the SP805FL supports multi-screen simultaneous display and 8K encoding/decoding, suitable for scenarios with high demands for image quality and multi-screen display, such as 3D scanning/printing, commercial large screens, and smart retail.

For wireless connectivity, the SP805FL-WF version features Wi-Fi 7 and Bluetooth 6.0, enabling high-speed and stable wireless data transmission. It also integrates multi-constellation GNSS positioning, compatible with GPS/BDS/GLONASS/Galileo/QZSS/NAVIC, and supports L1+L5 dual-band positioning, providing precise positioning services for scenarios like intelligent transportation and logistics platforms.

For industrial-grade scenarios, the product supports a wide operating temperature range of -35°C to +75°C, making it suitable for various complex industrial environments. Global certifications such as CE/RCM/FCC/IC are currently in progress, ensuring compliance with global deployment requirements in the future.

Abundant Interfaces for Flexible Expansion: Simplifying Development, Reducing Costs, and Increasing Efficiency

The SP805FL offers an interface lineup far exceeding conventional smart modules, providing strong expandability. In addition to traditional interfaces like MIPI DSI/CSI, I2S, UART, SDIO, I2C, and SPI, it also supports multiple PCIe lanes and dual Gigabit Ethernet ports, greatly enhancing its flexibility and adaptability in on-device AI applications.

The module adopts an LGA small-size package design, allowing high computing power to be easily integrated into smaller terminal products. Developers do not need to add external interface or computing chips; a single module can meet most device connectivity needs, effectively simplifying hardware design and shortening the development cycle.

The launch of Quectel’s SP805FL marks a key transition for smart modules from “data transmission pipelines” to “independent decision-making units at the edge.”

From June 24 to 26, MWC26 Shanghai is in full swing. We sincerely invite industry partners to visit Quectel’s dual booths at N2 Hall, Booth D72, and N4 Hall, Booth G48 to experience the limitless potential of on-device AI!

About Quectel

Shanghai Quectel Communication Technology Co., Ltd. (Stock Code: 603236) is a globally leading provider of comprehensive IoT solutions. It offers a complete range of IoT products and services, including cellular modules (5G/4G/3G/2G/LPWA), automotive pre-installed modules, smart modules (5G/4G/edge computing), short-range communication modules (Wi-Fi & BT), GNSS positioning modules, satellite communication modules, antennas, and other hardware products, as well as AI solutions, IoT platforms, industrial intelligence, smart agriculture, certification and testing services, and RTK network correction services. The company has extensive industry experience, and its products are widely used in fields such as smart transportation, smart energy, financial payment, smart cities, wireless gateways, smart agriculture & environmental monitoring, smart industry, smart living & healthcare, and smart security. For more information, please visit Quectel’s official website at https://www.quectel.com.cn/, follow the WeChat public account/WeChat video channel “Quectel,” or send an email.

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