XiamenApril 27, 2026 /PRNewswire/ — What is most lacking in the computing power boom? Who is supporting the ultra-high-speed transmission of massive data in the digital economy era? The answer is high-speed optical communication chips—the “core engines” of data centers and 5G/6G networks. Recently, Sanan Optoelectronics’ subsidiary, Sanan Optoelectronics Communication, disclosed its latest progress: leveraging its full-chain vertical integration capabilities, the company has achieved mass production of mainstream optical chips such as DFB, EML, and VCSEL, with a monthly output of millions of units, aiming for a key position in the global supply chain.
Production “Aircraft Carrier”: Mainstream Optical Chip Monthly Output Exceeds 200KK
Currently, Sanan Optoelectronics Communication’s monthly production capacity for DFB/EML/FP chips reaches 12KK, PD/APD chips at 40KK, and communication VCSEL and consumer VCSEL at 20KK and 150KK respectively, covering diverse scenarios such as telecommunications, data centers, and consumer electronics. The monthly output of epitaxial wafers has increased from 2,750 to 6,000 pieces, enabling a dual-drive model of self-supply and external sales. Through a full-process IDM model, the company has significantly improved capacity utilization and delivery efficiency, ensuring a stable and smooth supply chain.
IDM + Foundry Dual Model: One-Stop Solution to Manufacturing Challenges
As one of the few domestic manufacturers with capabilities in both GaAs and InP material systems, Sanan Optoelectronics Communication offers full-cycle foundry services from epitaxial customization and wafer fabrication to packaging and testing. The epitaxial stage supports customized growth on 2-6 inch wafers, compatible with 1.25G-400G full-rate processes; wafer fabrication yields reach internationally leading levels. Additionally, it opens up high-end process platforms, supporting flexible production of multiple varieties and small batches, as well as rapid switching to large-scale mass production.
Technological Breakthroughs: 100G EML Chip Self-Sufficiency, CW Light Source Targets 1.6T Optical Modules
Sanan has built a full-rate product matrix from 1.25G to 400G. Its self-developed 100G EML chip is compatible with 800G optical module solutions, achieving full-process self-sufficiency from design to manufacturing. CW light sources cover 70mW/100mW power specifications, meeting the needs of 400G to 1.6T high-speed optical modules. Core processes such as high-precision lithography and epitaxial growth form technological barriers, with wafer fabrication yields leading domestically.
Products have penetrated into data centers, telecommunications transmission, automotive optical communications, industrial internet, and consumer electronics. CW light sources, high-speed EML, and VCSEL are fully compatible with 800G/1.6T optical modules; telecommunications products are used in 5G base stations, fiber-to-the-home, and backbone networks; automotive-grade VCSEL and PD chips have established partnerships with global leading new energy vehicle manufacturers and Tier 1 suppliers, applied in autonomous driving LiDAR and smart cockpits. Additionally, the company has expanded into emerging scenarios such as industrial sensing, AR/VR, and laser medical treatments.
From capacity expansion to technological self-sufficiency, from foundry services to multi-scenario implementation, Sanan Optoelectronics Communication is playing an increasingly important role in the global optical chip industry landscape. Against the backdrop of rising AI computing power and the digital economy, Sanan Optoelectronics Communication is striving to move toward the high end of the global value chain. Stay tuned.